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Synthesis and Thermal Properties of Epoxy Resins Cured with Lignin-related Biphenols Having Syringyl Structure
https://doi.org/10.57375/00001586
https://doi.org/10.57375/00001586fb1428f3-fac5-48f6-8d6e-9ea6d5118485
| 名前 / ファイル | ライセンス | アクション |
|---|---|---|
174-179.pdf (5.0 MB)
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| Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
|---|---|---|---|---|---|---|
| 公開日 | 2016-07-21 | |||||
| タイトル | ||||||
| タイトル | Synthesis and Thermal Properties of Epoxy Resins Cured with Lignin-related Biphenols Having Syringyl Structure | |||||
| 言語 | ||||||
| 言語 | eng | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | Lignin-related Phenols | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | Biphenols | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | Curing Agent, | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | Curing Reaction | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | Glass Transition Temperature | |||||
| キーワード | ||||||
| 主題Scheme | Other | |||||
| 主題 | Syringyl Groups | |||||
| 資源タイプ | ||||||
| 資源タイプ識別子 | http://purl.org/coar/resource_type/c_6501 | |||||
| 資源タイプ | departmental bulletin paper | |||||
| ID登録 | ||||||
| ID登録 | 10.57375/00001586 | |||||
| ID登録タイプ | JaLC | |||||
| 著者 |
Hirose, Shigeo
× Hirose, Shigeo× Sakamoto, Yusuke× Sugamori, Yoshihiko |
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| 抄録 | ||||||
| 内容記述タイプ | Abstract | |||||
| 内容記述 | 4,4'-Dihydroxy3,3',5,5'-teramethoxybiphenyl(DHTMB) was synthesized from syringol, which can be obtained by thermal and hydration degradation of lignin. As the model reaction for curing, octaethylene glycol diglycidyl ether was cured with DHTMB and also with4,4'-dihydroxybiphenyl (DHB) in the presence of 2-ethyl-4-methylimidazole (2E4MI).Curing reaction was studied by differential scanning calorimetry (DSC). The calculated activation energies (E's) were almost the same values for both curing systems. The mixture of epoxy compounds consisting of trimethylopropane triglycidyl ether and diethylene glycol diglycidyl ether was cured with DHTMB in the presence of 2E4MI. The above mixture of epoxy compounds was also cured with DHB. Thermal properties of cured epoxy resins were investigated by DSC. Glass transition temperature determined by DSC was 46.6℃ for that cured with DHTMB and 38.8℃ for that with DHB, suggesting that the existence of bulky methoxyl groups in syringyl structure restricts the main chain motion of cured epoxy resin. | |||||
| 書誌情報 |
福井工業大学研究紀要 号 46, p. 174-179, 発行日 2016-07-21 |
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| 出版者 | ||||||
| 出版者 | 福井工業大学 | |||||
| 書誌レコードID | ||||||
| 識別子タイプ | NCID | |||||
| 関連識別子 | TF00010467 | |||||
| 著者版フラグ | ||||||
| 出版タイプ | VoR | |||||
| 出版タイプResource | http://purl.org/coar/version/c_970fb48d4fbd8a85 | |||||
