{"created":"2023-06-20T13:42:44.003087+00:00","id":293,"links":{},"metadata":{"_buckets":{"deposit":"298aa8ac-4bf5-4a21-825c-bbfada16f6ae"},"_deposit":{"created_by":2,"id":"293","owners":[2],"pid":{"revision_id":0,"type":"depid","value":"293"},"status":"published"},"_oai":{"id":"oai:fut.repo.nii.ac.jp:00000293","sets":["1"]},"author_link":["9479","9477","9475","9480","9478","9476"],"item_10002_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2003-03-20","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"33","bibliographicPageEnd":"118","bibliographicPageStart":"111","bibliographic_titles":[{"bibliographic_title":"福井工業大学研究紀要. 第一部"}]}]},"item_10002_description_5":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"As a result of research on slicing SiC polycrystalline bulk materials into thin round plate, it was found that wire saw of horizontal type is more suitable for slicing difficult-to-machine materials like SiC than that of vertical one and that a combination of plain steel wire and diamond slurry is more preferable than diamond dispersed Cu plated wire. Crystalline distortion introduced by slicing, polishing of β-SiC was investigated with X-ray diffraction and each surface subjected to processing like slicing, mechanical polishing and chemo-mechanical polishing was not thought to be distorted.","subitem_description_type":"Abstract"}]},"item_10002_identifier_registration":{"attribute_name":"ID登録","attribute_value_mlt":[{"subitem_identifier_reg_text":"10.57375/00000287","subitem_identifier_reg_type":"JaLC"}]},"item_10002_publisher_8":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"福井工業大学"}]},"item_10002_relation_11":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_relation_type_id":{"subitem_relation_type_id_text":"TF00008746","subitem_relation_type_select":"NCID"}}]},"item_10002_source_id_9":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"2868571","subitem_source_identifier_type":"ISSN"}]},"item_10002_version_type_20":{"attribute_name":"著者版フラグ","attribute_value_mlt":[{"subitem_version_resource":"http://purl.org/coar/version/c_970fb48d4fbd8a85","subitem_version_type":"VoR"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"河合, 伸泰"}],"nameIdentifiers":[{"nameIdentifier":"9475","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"後藤, 徹"}],"nameIdentifiers":[{"nameIdentifier":"9476","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"脇浜, 智"}],"nameIdentifiers":[{"nameIdentifier":"9477","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Kawai, Nobuyasu","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"9478","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Goto, Toru","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"9479","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"Wakihama, Satoshi","creatorNameLang":"en"}],"nameIdentifiers":[{"nameIdentifier":"9480","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2023-04-12"}],"displaytype":"detail","filename":"KJ00004279690.pdf","filesize":[{"value":"620.8 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"KJ00004279690.pdf","url":"https://fut.repo.nii.ac.jp/record/293/files/KJ00004279690.pdf"},"version_id":"6deb2f31-b6e6-4f13-bc85-638554f9a51f"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"SiCの切断加工および研磨加工に伴う欠陥に関する研究","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"SiCの切断加工および研磨加工に伴う欠陥に関する研究"},{"subitem_title":"Research on crystalline defects introduced by slicing and polishing SiC polycrystalline","subitem_title_language":"en"}]},"item_type_id":"10002","owner":"2","path":["1"],"pubdate":{"attribute_name":"公開日","attribute_value":"2009-04-04"},"publish_date":"2009-04-04","publish_status":"0","recid":"293","relation_version_is_last":true,"title":["SiCの切断加工および研磨加工に伴う欠陥に関する研究"],"weko_creator_id":"2","weko_shared_id":-1},"updated":"2023-06-20T14:35:36.304468+00:00"}